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Electroplating Analysis

ELECTROPLATING ANALYSIS

Txheej Txheej

Txheej Abbreviation

Xim

Txheej Thickness
(μm)

Kev sib piv ntawm txheej txheej tiv thaiv qhov muaj peev xwm

Pom zoo thov kub
(℃)

Nto Ntog

Neutral Salt Spray Test

Humidity Kub Test

PCT Test

Ni / Barrel Plating

Ni

Ci nyiaj

10-20

☆☆☆☆☆

☆☆☆☆☆

☆☆☆☆☆

≤ 260

36

Ni/Rack Plating

Ni

Ci nyiaj

10-20

☆☆☆☆

☆☆☆☆☆

☆☆☆☆☆

≤ 260

36

3 + Cr Zn / Xiav-White Zn / Barrel Plating

Zn

Xiav & dawb

5-10

☆☆☆☆

☆☆☆ Ib

☆☆☆ Ib

≤160

38

3 + Cr Zn / Xiav-White Zn / Khib Plating

Zn

Xiav & dawb

5-10

☆☆☆ Ib

☆☆☆ Ib

☆☆☆ Ib

3 + Cr Xim Zn / Barrel Plating

Xim Zn

Cov xim ci

5-10

☆☆☆ Ib

☆☆☆ Ib

☆☆☆ Ib

3 + Cr Xim Zn / Khib Plating

Xim Zn

Cov xim ci

5-10

☆☆☆ Ib

☆☆☆ Ib

☆☆☆ Ib

Ni + Tshuaj Ni Barrel Plating

Ni + Chemical Ni

Tsaus nyiaj

12-20

☆☆☆☆☆

☆☆☆☆☆

☆☆☆☆

≤200

36

Ni + Chemical Ni Rack Plating

Ni + Chemical Ni

Tsaus nyiaj

12-20

☆☆☆☆

☆☆☆☆☆

☆☆☆☆

Ni+ Cr

Ni+ Cr

Tsaus dub

12-20

☆☆☆☆

☆☆☆☆☆

☆☆☆☆☆

≤ 260

36

Teflon

Teflon

grey tsaus

 

☆☆☆ Ib

☆☆☆ Ib

☆☆☆ Ib

≤ 260

36

Ni + Dub

Ni + Dub

dub

12-20

☆☆☆☆☆

☆☆☆☆☆

☆☆☆☆☆

Nia + Sn

Nia + Sn

Ci nyiaj

12-20

☆☆☆☆

☆☆☆☆☆

☆☆☆☆☆

-

36

Ni + Ag

Ni + Ag

Nyiaj

12-20

☆☆☆☆

☆☆☆☆☆

☆☆☆☆☆

-

36

Ni+Au

Ni+Au

Golden

10-20

☆☆☆☆

☆☆☆☆☆

☆☆☆☆☆

-

36

Epoxy

EPOXY

dub

10-20

☆☆☆☆☆

☆☆☆☆☆

☆☆☆☆

≤160

36

NiCu + Epoxy

NiCuNi/NiCu+EPOXY

dub

15-25

☆☆☆☆☆

☆☆☆☆☆

☆☆☆ Ib

≤160

36

Passivation / Phosphatization

Phosphoric / Passivation

grey tsaus

1-3

≤ 240

37

Nano Txheej

Nano txheej

Lub teeb grey
dub

15-30

☆☆☆☆☆☆☆

☆☆☆☆☆☆☆

☆☆☆☆☆☆☆☆

≤300

33

Nco tseg

1. SST Ib puag ncig: 35 ± 2 ℃, 5% NaCl, PH = 6.5-7.2, ntsev tsuag dej 1.5ml / Hr.

2. PCT Ib puag ncig: 120 ± 3 ℃, 2-2.4atm, dej distilled PH = 6.7-7.2, 100% RH

Thov hu rau peb rau txhua qhov kev thov tshwj xeeb