ELECTROPLATING ANALYSIS
Txheej Txheej | Txheej Abbreviation | Xim | Txheej Thickness | Kev sib piv ntawm txheej txheej tiv thaiv qhov muaj peev xwm | Pom zoo thov kub | Nto Ntog | ||
Neutral Salt Spray Test | Humidity Kub Test | PCT Test | ||||||
Ni / Barrel Plating | Ni | Ci nyiaj | 10-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ≤ 260 | 36 |
Ni/Rack Plating | Ni | Ci nyiaj | 10-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ≤ 260 | 36 |
3 + Cr Zn / Xiav-White Zn / Barrel Plating | Zn | Xiav & dawb | 5-10 | ☆☆☆☆ | ☆☆☆ Ib | ☆☆☆ Ib | ≤160 | 38 |
3 + Cr Zn / Xiav-White Zn / Khib Plating | Zn | Xiav & dawb | 5-10 | ☆☆☆ Ib | ☆☆☆ Ib | ☆☆☆ Ib | ||
3 + Cr Xim Zn / Barrel Plating | Xim Zn | Cov xim ci | 5-10 | ☆☆☆ Ib | ☆☆☆ Ib | ☆☆☆ Ib | ||
3 + Cr Xim Zn / Khib Plating | Xim Zn | Cov xim ci | 5-10 | ☆☆☆ Ib | ☆☆☆ Ib | ☆☆☆ Ib | ||
Ni + Tshuaj Ni Barrel Plating | Ni + Chemical Ni | Tsaus nyiaj | 12-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆ | ≤200 | 36 |
Ni + Chemical Ni Rack Plating | Ni + Chemical Ni | Tsaus nyiaj | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆ | ||
Ni+ Cr | Ni+ Cr | Tsaus dub | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ≤ 260 | 36 |
Teflon | Teflon | grey tsaus |
| ☆☆☆ Ib | ☆☆☆ Ib | ☆☆☆ Ib | ≤ 260 | 36 |
Ni + Dub | Ni + Dub | dub | 12-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ||
Nia + Sn | Nia + Sn | Ci nyiaj | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | - | 36 |
Ni + Ag | Ni + Ag | Nyiaj | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | - | 36 |
Ni+Au | Ni+Au | Golden | 10-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | - | 36 |
Epoxy | EPOXY | dub | 10-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆ | ≤160 | 36 |
NiCu + Epoxy | NiCuNi/NiCu+EPOXY | dub | 15-25 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆ Ib | ≤160 | 36 |
Passivation / Phosphatization | Phosphoric / Passivation | grey tsaus | 1-3 | — | — | — | ≤ 240 | 37 |
Nano Txheej | Nano txheej | Lub teeb grey | 15-30 | ☆☆☆☆☆☆☆ | ☆☆☆☆☆☆☆ | ☆☆☆☆☆☆☆☆ | ≤300 | 33 |
Nco tseg
1. SST Ib puag ncig: 35 ± 2 ℃, 5% NaCl, PH = 6.5-7.2, ntsev tsuag dej 1.5ml / Hr.
2. PCT Ib puag ncig: 120 ± 3 ℃, 2-2.4atm, dej distilled PH = 6.7-7.2, 100% RH
Thov hu rau peb rau txhua qhov kev thov tshwj xeeb